Arteris, Inc., a provider of system IP for semiconductor development, announced an expansion of its multi-die solution to support chiplet-based designs. The solution addresses the increasing ...

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced new collaborations with TSMC to support the foundry’s latest process ...

Samsung held a tool-in ceremony for its new semiconductor research and development complex (NRD-K) at its Giheung campus, marking a significant leap into the future. About 100 guests, including those ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

Market researcher Omdia reported the AI processors for cloud and the data center market has grown from just under $10bn in 2022 to $78bn this year (2024), and Omdia expects it will eventually reach ...

Texas Instruments announced introduction of six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack integrated ...

ABI Research said the chipset revenues from AI-dedicated silicon for IoT-focused applications reaching over US$7.3 billion by 2030. The trend driving this growth is due to embedded chipset vendors ...

STMicroelectronics has made available the EVLDRIVE101-HPD (High Power Density) motor-drive reference design featuring a 3-phase gate driver, STM32G0 microcontroller, and 750W power stage on a circular ...

ROHM announced the launch of its new LogiCoA, a power supply solution for small to medium power industrial and consumer equipment (30W to 1kW class). It provides the same functionality as fully ...

SK hynix has developed the Zoned UFS, or ZUFS1 4.0, a mobile NAND solution product for on-device AI applications. SK hynix said that the ZUFS 4.0, optimized for on-device AI from mobile devices such ...

Intel said starting third quarter of 2024 in time for the holiday season, Intel’s upcoming client processors (code-named Lunar Lake) will power more than 80 new laptop designs across more than 20 ...