China urged the Dutch government Monday to “immediately revoke” its administrative order against semiconductor manufacturer Nexperia, an overseas subsidiary owned by Chinese company Wingtech ...

The global Foundry 2.0 market's revenue rose by 17% year-on-year (YoY) in the third quarter to reach $84.8 billion.

The global consortium reports that AI and machine learning (ML) are extending Ethernet speeds to 3.2T and beyond. With advances in higher speed interfaces, more interconnect options, and advancements ...

IAR extends its RISC-V toolchain support to SiFive’s automotive E7A and S7A IP cores. Dec. 24, 2025 – IAR and SiFive, Inc. have announced support for SiFive’s Automotive IP ...

T2M-IP, a global semiconductor IP provider and ASIC services partner, today announced the global availability of its complete RISC-V CPU IP portfolio, spanning ultra-low-power MCU-class cores to ...

The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and is projected to grow to USD 114.28 billion in 2034, according to research conducted by ...

The advantage of eSIM in enabling global IoT connectivity without a physical SIM card presents significant opportunities for enterprises: global IoT connectivity, lower operating costs, and more ...

2025 saw a dramatic change in the fortunes of AI chip makers, with Nvidia in particular benefitting. The growth in AI by companies such as OpenAI catapulted Nvidia into the top slot as the world’s ...

Nvidia stock tumbled nearly 1% on Wednesday after reports surfaced that the AI chipmaker has paused testing of Intel’s ambitious 18A manufacturing process.

As TSMC ramps up its U.S. and Japan expansions, all eyes are on the so-called “N-2” rule, which, according to the Central News Agency, could prevent the foundry giant from producing its most advanced ...

Arm ’s market value dropped sharply following Qualcomm’s announcement of its acquisition of Ventana Micro Systems, triggering renewed concern about the British chip designer’s long term position.

With the recent ratification of the Universal Chiplet Interconnect Express (UCIe) 3.0 standard in August 2025, the industry has finally established a "lingua franca" that allows chips from different ...