Abstract: Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap [(U)WBG] materials. These materials, such ...
Worse, the most recent CERN implementation of the FPGA-Based Level-1 Trigger planned for the 2026-2036 decade is a 650 kW system containing an incredibly high number of transistor, 20 trillion in all, ...
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