Dubai-based telco Du and NextGenAI have partnered for the deployment of an advanced AI supercluster. Unveiled last month at the GITEX Global event, the cluster is housed at Du’s DSO data center in ...
COPENHAGEN, Denmark, Oct. 23, 2025 /PRNewswire/ -- DCAI, an AI infrastructure provider that operates the Danish supercomputer Gefion, today announced that it will be one of the first in Europe and the ...
At the 2025 OCP Global Summit in San Jose, ASRock Rack and ZutaCore jointly unveiled what they're calling the first NVIDIA HGX B300 system with fully integrated "waterless liquid cooling." The new ...
Thailand’s new minister of tourism and sports has vowed to start collecting a 300-baht tourism tax during his four-month term and instructed the relevant parties to communicate the benefits of the ...
TL;DR: NVIDIA is developing the Blackwell B30A AI chip for China, featuring a single-die design that outperforms the Hopper H20 but delivers half the performance of the high-end Blackwell Ultra B300.
The world’s most valuable chipmaker is far from giving up its desire to retain China as a key growth market. Nvidia is apparently putting together a new AI chip meant for sale in China that’s half as ...
El Salvador has made the world’s first sovereign purchase of Nvidia B300 GPUs. According to a post from the country’s National Bitcoin Office (ONBTC) on social media platform X, the Blackwell Ultra ...
El Salvador, under the presidency of Nayib Bukele, placed an order for Nvidia Corp.'s (NASDAQ:NVDA) B300 chips, a powerful artificial intelligence processor that is not yet available to most of the ...
Speculation swirled online about a potential Boeing-Airbus collaboration on a futuristic aircraft dubbed the B300 MAX. The concept, which supposedly blends parts of the 787 and A350 with supersonic ...
Analyst views launch as confirmation that the chip maker is ‘looking to regroup and pick fights it thinks it can win.’ Credit: Intel szuka gotówki / Fot. Piotr Swat, Shutterstock.com Intel on Thursday ...
Nvidia is pushing production of its new B300 AI chip forward to May, using Taiwan Semiconductor Manufacturing’s latest 5nm (N4P) process and CoWoS-L advanced packaging technology. Sources at Ctee ...
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