Abstract: 64Mp CIS with 0.5um pixels has been developed with three wafer layers (e.g. top-wafer for PDs and TG TRs, mid-wafer for pixel TRs, and bottom-wafer for the analog and logic circuits). The ...
Abstract: Vision-based tactile sensors have drawn increasing interest in the robotics community. However, traditional lens-based designs impose minimum thickness constraints on these sensors, limiting ...
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