Abstract: This paper describes the design of a 1.24pJ/b 112Gb/s PAM4 transceiver testchip in 7nm FinFET for in-package die-to-die communication. The receiver supports 0-1.2V input common mode and ...

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Abstract: The continued increase in computing capability that has occurred through the technology scaling foretold by Moore [1] and Dennard et al. [2] has led to a commensurate increase in the ...