Addressing Computing’s Growing Carbon Footprint It’s no secret that our digital lives are getting bigger and bigger.
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
The Department of Energy (DOE) has released specifications for 26 artificial intelligence (AI) challenges under its Genesis Mission that could reshape how ...
In a long-running collaboration with GE Aerospace, researchers at the University of Melbourne in Australia have been steadily ...
High-performance computing (HPC) systems, with enormous computational capabilities, have been the go-to solution for decades ...
The Department for Science, Innovation and Technology (DSIT) is calling for input to shape the UK’s future AI compute ...
In a long-running collaboration with GE Aerospace, researchers at the University of Melbourne in Australia have been steadily ...
Discover Apple’s M5 Ultra Mac Studio with groundbreaking M5 Max and M5 Ultra chips, redefining high-performance computing at WWDC.
On 5 February, the nine projects retained for co-funding in the context of the joint call for projects "High-Performance Computing and Artificial Intelligence" were announced by the Ministry of the ...
Quantum computing technology is complex, getting off the ground and maturing. There is promise of things to come. potentially changing the computing paradigm.
The US DOE has launched the Teton supercomputer at INL, quadrupling computing power to accelerate high-fidelity nuclear ...
Athena, NASA's latest supercomputer, went online in January following a beta testing period. The US space agency says the new ...
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