Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...

WASHINGTON/SAN FRANCISCO, Dec 12 (Reuters) - Chipmaker Intel (INTC.O), opens new tab, has tested chipmaking tools this year from a toolmaker with deep roots in China and two overseas units that were ...

Skip Clark, whose son Zach has Down syndrome, speaks with “Enable: The Disability Podcast” about the pain of hearing the R-word and why you should never underestimate a person’s special abilities. He ...

The embrace of AI meeting-transcription services in the workplace puts employers at risk of privacy lawsuits, breaches of confidentiality, and a host of other legal problems that could outweigh the ...

The technology experts at Digital Trends highlight TurboX robot vacuum setting new runtime records at CES. King Charles III reveals major cancer update in rare message US forces raid ship, seize cargo ...

Southwest Airlines announced a new partnership with German carrier Condor, enabling single-ticket transatlantic itineraries that link Condor’s long-haul flights with Southwest’s U.S. network.

While some unreliable cars are worth the headache, reliability will always be an important factor for most buyers. This is especially relevant when it comes to turbocharged engines. Known for their ...

Intel invests RM860M in Malaysia, boosting its role in global chip assembly and testing. Malaysia strengthens semiconductor packaging as nations diversify supply chains. Intel’s expansion underscores ...