Which Engineering Branch Is known As The Circuit Savants?

Find out why engineers in the fields of electrical and electronic engineering (EE and ECE) are referred to as 'Circuit ...
Nanowerk

Graphene transistors turn nanoscale flaws into unclonable digital fingerprints

Atomic-scale imperfections in graphene transistors generate unique wireless fingerprints that cannot be copied or predicted, ...
Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer of ultra-pure silicon. The bottom-most layer, also known as the front end ...
Science Daily

This tiny chip could change the future of quantum computing

A new microchip-sized device could dramatically accelerate the future of quantum computing. It controls laser frequencies ...
Nanowerk

Nanowire transistors replicate how the retina edits before the brain sees

Tellurium nanowire transistors switch between boosting and suppressing their light response through voltage alone, enabling ...
The American Bazaar

Indian American-led engineers develop 3D chips to accelerate AI

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Quantum technologies have reached a critical stage in their growth

Quantum information science is no longer confined to chalkboards and controlled laboratory tests. You now see working quantum ...
Semiconductor Engineering

3D-IC Market Outlook: Technology Roadmaps, Readiness, And Design Implications

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Semiconductor Engineering

What’s Next for 2.5D Packaging?

Interposers are effectively platforms on which multiple components can be assembled — like a micro-sized PCB. The primary material today is silicon, and their sizes, even when built on older process ...