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Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

AI can optimize patterns, but only humans can create connection.

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Namaswi Chandarana, a senior engineer at GameChanger, said "the most important survival skill" in a tech job is communication ...

In Cupertino, Monocle sits down with Apple’s design team to uncover how the 5.6mm model was engineered, coloured and ...