IEEE

Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability

Abstract: A large silicon chip or interposer is mounted onto a large package substrate using flip-chip for high performance computing (HPC) such as artificial intelligence (AI) and fifth generation ...
Science Daily

Why consciousness can’t be reduced to code

The familiar fight between “mind as software” and “mind as biology” may be a false choice. This work proposes biological computationalism: the idea that brains compute, but not in the abstract, symbol ...
IEEE

Theoretical Modeling of Substrate-Integrated Impedance Surfaces

Abstract: Substrate-integrated impedance surfaces (SIISs) or substrate-integrated metasurfaces (SIMSs) have recently been proposed to tailor the dispersion and eigenmodes of waveguides, resonators, ...
C&EN

Interpenetration of Rubber and Silane Coupling Agent on an Inorganic Substrate Revealed by Spin-Contrast-Variation Neutron Reflectivity

Materials Sciences Research Center, Japan Atomic Energy Agency, Tokai, Ibaraki 319-1195, Japan J-PARC Center, Japan Atomic Energy Agency, Tokai, Ibaraki 319-1195, Japan ...
Sky

Oxford Dictionary publisher reveals Word of the Year 2025 - do you know it?

Don't get too upset, but 'rage bait' has been named by Oxford University Press as this year's Word of the Year, beating other online terms. The group behind the Oxford English Dictionary says the term ...