MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.

For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is ...

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Traditional CMOS chips are fabricated by applying and then etching repeated layers of different materials, applied to a wafer ...

Described in a study published Dec. 8 in Nature Electronics, BISC includes a single-chip implant, a wearable “relay station,” and the custom software required to operate the system. “Most implantable ...

TAIPEI, Dec. 15, 2025 /PRNewswire/ -- Meridian Innovation's Cheetah thermal imaging sensor claimed this year's Best Sensor of ...

Public records clearly shows that for the past 25 years, CERN has repeatedly built inadequate FPGA-based Level-1 Triggers, necessitating multiple rebuilds. During the Higgs boson discovery ...

Artificial intelligence is colliding with a hard physical limit: the energy and heat of today’s silicon-based chips. As ...

A radically miniaturized brain implant called BISC is redefining what’s possible in human–computer interaction, offering a ...

Figure 1: Magnetoresistive head for hard-disk recording. The MRAM potentially combines key advantages such as non-volatility, infinite endurance and fast random access (down to 5 ns read/write time 34 ...