If 2025 belonged to anyone it was the KPop Demon Hunters. The animated movie became Netflix's most unexpected hit, becoming ...

Abstract: Through-silicon via (TSV), micro bump, and hybrid bonding are three critical structures for three-dimensional (3D) integrated circuits (IC) stacking technology. The large-scale (~urn level) ...

Explore the top online animation courses covering 2D, 3D, motion graphics, and storytelling using tools like Blender and ...

Pedro Conti is a São Paulo–based director, production designer and 3D visual development artist whose animation work is ...