Abstract: 3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration ...
The Chicago Manual of Style is an American English style guide published by the University of Chicago Press. The Manual’s guidelines for publishing, style and usage, and citations and indexes—known as ...
An illustration of a magnifying glass. An illustration of a magnifying glass.
Abstract: The standard cooling approach for medium to high power microprocessor devices remains air cooling. However, increasing power density has driven overall interest in alternative, more ...
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