Abstract: Toward a next generation co-packaged optics, we have been developing a novel package substrate working as optoelectronic conversion engines and providing optical redistribution (ORDL) ...
Current AMD Ryzen desktop processors that use stacked 3D V-Cache top out at 128 MB of L3 from a single die. However, a recent post from ...
Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.
Arm stock declines massively as Qualcomm acquires RISC-V designer Ventana Micro, suggesting plans to deepen its work with the instruction set architecture ...
The 2026 Design and Verification Conference and Exhibition (DVCon U.S.) has unveiled its keynote speakers and an array of tutorials and workshops, highlighting advancements in AI-driven technologies ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback