Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...
Top AI researchers like Fei-Fei Li and Yann LeCun are developing world models, which don't rely solely on language.
Creative hobbyists, get ready for a glow-up. Here are my predictions for 3D printers, laser engravers and more.
Interesting Engineering on MSN
Single string pull turns flat designs into 3D structures for modular space habitats
A new single-string method lets flat designs deploy into complex 3D structures, with potential uses in modular space habitats ...
The model allows scientists to study interactions between the womb and embryo, and look for causes behind implantation ...
The next step in the evolution of generative AI technology will rely on ‘world models’ to improve physical outcomes in the real world.
Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.
Spatial computing technologies like Vision Pro FX are transforming Indian operating rooms by enabling real-time 3D ...
Morning Overview on MSN
World’s oldest 3D map found in a cave, and it’s interactive
A set of mysterious grooves on a cave floor in France has turned out to be far more than abstract art. Archaeologists now ...
Engineers from Stanford University, Carnegie Mellon University, University of Pennsylvania, and the Massachusetts Institute of Technology worked with ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
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