Abstract: Fusion and hybrid wafer-to-wafer bonding are key enabling processes for device scaling and wafer level packaging. Shrinking technology nodes combined with raising wafer complexities require ...
Ford is breaking records for all the wrong reasons - 152 recalls in 2025 eclipses decade-old industry high. Quality issues ...
Following two recalls over problematic hybrid transmission internal park module software, Ford has issued a third recall to ...
IoT-Based Multisensors Fusion for Activity Recognition via Key Features and Hybrid Transfer Learning
Abstract: Human activity recognition (HAR) has attracted significant attention in various fields, including healthcare, smart homes, and human-computer interaction. Accurate HAR can enhance user ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback