SK hynix merges DRAM and NAND into a single package for faster AI performance

According to multiple Korean sources, SK hynix is developing a new type of computer memory aimed at accelerating local ...
Semiconductor Engineering

AI Memory: Enabling The Next Era Of High-Performance Computing

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions.
Tech Xplore on MSN

Mapping AI's brain reveals memory and reasoning are not located in the same place

Researchers studying how large AI models such as ChatGPT learn and remember information have discovered that their memory and ...
TweakTown

SK hynix reportedly making High Bandwidth Storage (HBS): stacked chips for next-gen smartphones

SK hynix's rumored HBS (High Bandwidth Storage) uses stacked mobile DRAM and NAND chips into a single package, for next-gen ...
CNET on MSN

How Much Unified Memory Do I Need in a Mac?

Apple's UMA design -- a single, fixed pool of RAM integrated into the die with the CPU, GPU and NPU -- makes Mac and MacBook configuration choices a little different than it used to be.
Semiconductor Engineering

Interplay Between the Row Hammer Effect and Floating Body Effect in Monolithic 3D Stackable 1T1C DRAM (Georgia Tech)

A new technical paper titled “Row Hammer Effect and Floating Body Effect of Monolithic 3D Stackable 1T1C DRAM” was published ...