Abstract: This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power module packaging with optimized electrical and thermal performances. The structure of the module is to ...
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This ...
The overview of CBAM. The module has two sequential sub-modules: channel and spatial. The intermediate feature map is adaptively refined through our module (CBAM) at every convolutional block of deep ...
Provides features to aid usage and discovery of modules, providing: If you like and use this project and are happy to let us know, please raise a GitHub issue, create a PR or contact MatthewJohn so it ...
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