Bourns, Inc. introduced its Riedon RTDW Series Resistance Temperature Sensors by Bourns. Designed to deliver precise ...
Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...
In a new paper published in Nature Photonics, researchers at Columbia Engineering have discovered that the thin-film metallic resistor routinely used to thermally tune photonic devices to the desired ...
Infineon has released the EasyPACK C, the latest addition to its EasyPACK family of power modules. The first products in this series use 1200V CoolSiC MOSFET G2 devices combined with Infineon’s.XT ...