Abstract: In advanced CMOS technology nodes with Cu/low-k interconnect, metal hard-mask approach AIO etch is the key process to define the physical structure of Cu line and via. The via hole and via ...
Abstract: Silicon nitride (SiN) hard mask (HM) has been investigated to achieve sub-100nm of high aspect ratio (HAR) pattern. In this study, SiN HM trimming technique is developed by mean of cyclic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback