Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

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Abstract: In this article, we study the timely notion of short-packet communications, with specific focus on uplink rate-splitting multiple access (RSMA) systems under the finite blocklength regime.

Abstract: Object detection is a cornerstone of modern computer vision, driving advances in autonomous driving, robotics, surveillance, and smart infrastructure. However, detection performance and ...