A Texas A&M University chemical engineering professor is helping chart the path for micro light-emitting diode displays—known as micro-LEDs—that could transform how future electronic devices are ...

Abstract: For multi-chip stacking using Chip-to-Wafer (C2W) Hybrid Bonding (HB) technique, one prominent approach is Inter-Die Gap Filling (IDGF) method. A major challenge in IDGF flow is achieving ...

With that, good morning, everybody. Welcome to the Goldman Sachs Communacopia Technology Conference. I'm Jim Schneider, the semiconductor analyst here at Goldman Sachs. My pleasure to welcome ...

The Trojans (2-0) are outscoring opponents 40-3 through two contests and have a chip on their shoulder after quarterback Gibson Gross missed the postseason last season with an injury. “We know that ...

Abstract: III-V/Si hybrid SOAs with different epitaxial structures are monolithically integrated on an SOI wafer, using chip-on-wafer direct bonding process. The control of gain characteristics ...

This solution showcases the implementation of a Dual Active Bridge (DAB) application demonstration utilizing Microchip's dsPIC33C device, primarily aimed at automotive On-Board Charger applications.

This library was created to read the UID of tags presented to a PN5180 RFID reader, such as below: The PN5180 implements the ISO15693 "vicinity" protocol, which typically enables tags to be read at a ...

SK Hynix, Samsung will need licenses to buy US equipment for China US equipment makers KLA Corp, Lam Research, Applied Materials likely impacted Rule takes effect in 120 days The U.S. Commerce ...

In July, Jensen Huang heaped praise on Chinese AI models and signed autographs a day after the Trump administration allowed Nvidia to resume selling one of its advanced chips to Chinese customers.

Data centers have become a critical part of daily life. With the advent of artificial intelligence, machine learning and other high-performance computing, or HPC, applications, it’s estimated that ...