Abstract: We propose a novel technology called Bumpless Build Cube (BBCubeTM) 3D for AI and high-performance computing (HPC) applications that require high bandwidth and power efficiency. BBCube 3D is ...
Save on models across the board from Bambu Labs, Creality, Elegoo, and more. The deals also include filament and supplies. By Stan Horaczek Published Nov 28, 2025 10:34 AM EST We may earn revenue from ...
Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback