Abstract: The degraded thermal path of 3-D integrated circuits (3DICs) makes thermal analysis at the chip-scale an essential part of the design process. Performing an appropriate thermal analysis on ...
Abstract: The junction temperature is a significant indicator for evaluating the reliability of insulated gate bipolar transistors (IGBTs). In this article, in order to realize noninvasive and simple ...
This article is brought to you by our exclusive subscriber partnership with our sister title USA Today, and has been written by our American colleagues. It does not necessarily reflect the view of The ...
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