This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
IEEE

Co-Optimization of Microgrid Secondary Control and Communication QoS: A Cross-Layer Perspective in Cyber–Physical System

Abstract: In a microgrid with hierarchical control, a typical cyber–physical power system (CPPS), cyber failures may induce physical system damage in a cross-layer fashion. Particularly during extreme ...

Understanding the U.S. Bicameral System: Structure and History

Explore the U.S. bicameral legislature, its structure with the House of Representatives and Senate, and the historical ...
IEEE

Misalignment-Tolerant Wireless Power Transfer System Based on Double-Layer Quadrature Double-D Coil With Magnetic Field Control

Abstract: Aiming at the rapid decrease of coupling coefficient and transfer efficiency caused by misalignment during static wireless charging of electric vehicle, a high-misalignment-tolerance ...