Abstract: This article focuses on the 3-D modeling methodology development of the wafer-to-wafer hybrid bonding (W2W-HB) annealing process. With its successful application in a 2-stack wafer-to-wafer ...
Abstract: This paper presents a D-band 16-element phased-array transceiver IC with integrated dual-polarized antenna for 6G wireless communications. Fabricated in 28-nm CMOS, the transceiver operates ...
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