Abstract: Co-packaged optics (CPO) and three-dimensional (3D) optoelectronics represent a new frontier in high-speed data communication, targeting the rising demands for bandwidth, energy efficiency, ...
Abstract: Wafer level stacking of single crystal films enables 3D monolithic integration of electronic devices. The monolithic stacking technology based on Smart Cut TM enables front end integration ...
This project demonstrates an end-to-end data engineering solution built using Databricks Free Edition and Spark Declarative Pipelines (LakeFlow). The use case simulates a fast-growing cab service ...
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