Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Abstract: With an excessively indulgent diet and irregular routine, diabetes has emerged as a pervasive and life-threatening chronic condition. Real-time monitoring of glucose levels and stringent ...

A new year means that it's already time to start tracking upcoming movies for 2026 and beyond, and trust us folks, we are in ...

We address the thermal challenge of ultra-dense 3D (e.g., monolithic 3D) integrated circuits with multiple high-speed computing engines in the 3D stack. We present a new thermal scaffolding approach ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...