Abstract: 64Mp CIS with 0.5um pixels has been developed with three wafer layers (e.g. top-wafer for PDs and TG TRs, mid-wafer for pixel TRs, and bottom-wafer for the analog and logic circuits). The ...
Abstract: This work discloses a temperature sensor based on a polysilicon microelectromechanical systems (MEMS) resonator. The system exploits the temperature drift of the resonance frequency of two ...
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