Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Unexpected change rewards those who are quick to adjust, but all aspects of a system must be adjusted to keep growth going.

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Using AI and machine learning as transformative solutions for semiconductor device modeling and parameter extraction.

In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential. Growing design complexity, distributed teams, and the accelerating adoption of AI ...

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

A new technical paper titled “A Tensor Compiler for Processing-In-Memory Architectures” was published by researchers at ...