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WASHINGTON, DC – Global smartphone production reached 300 million units in the second quarter, marking a 4% quarter-over-quarter and 4.8% year-over-year increase, according to TrendForce. The rebound ...
Year-over-year sentiment continues to outpace month-to-month measures, with product index scores averaging between 141.1 and 142.4 since June. The third quarter Industry Pulse survey further ...
TOKYO, JAPAN – Panasonic Industry, part of the Panasonic Group, has announced an expansion of its MEGTRON multi-layer circuit board material production. The company plans to double output over the ...
INDIA – The Andhra Pradesh government has cleared an ₹856-crore incentive package to support the development of India’s largest printed circuit board (PCB) facility, to be established by Syrma SGS in ...
By collaboration and co-creation with other JOINT3 members, Zuken contributes to the evolution of design, manufacturing, and verification process for the next-generation semiconductor packaging with ...
WASHINGTON – SEMI announced that global semiconductor equipment billings reached $33.07 billion in the second quarter, representing a 24% year-over-year increase and a 3% quarter-over-quarter gain.
WASHINGTON, DC – The Semiconductor Industry Association (SIA) reported that global semiconductor sales reached $62.1 billion in July, a 20.6% increase year-over-year and a 3.6% rise month-over-month.
Schultz heads the design and integration of Rainmaker’s autonomous cloud seeding system, which works with nature to encourage precipitation, provide more freshwater, and mitigate drought and water ...
PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2025 New Product Introduction (NPI) Award winners for electronics assembly equipment, materials and software. The 18th annual NPI Awards ...
Uyemura has published “MEC from Uyemura: The Roadmap for High Density and Ultra-High Density Circuits.” ...
San Francisco Circuits launches a free PCB Stackup Calculator for 4–14 layer boards, helping designers configure stackups, materials, and vias with instant visualization and IPC 6012 guidance.
Stop designing products guaranteed to fail EMC testing. Au: This article emphasizes the need to concentrate on design of transmission lines, or the “spaces,” instead of the “wires.” The industry focus ...
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