At CES 2026, BOS will showcase its AI Box, an external physical AI computing module powered by Eagle-N, demonstrating a practical approach to scaling AI capabilities in vehicles without replacing ...
Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 TOKYO — Global ...
SEOUL, South Korea – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interface IP solutions, announced today that it has ...
Prediction: IoT Analytics expects 2026 to bring wider adoption of AI-aware EDA flows and off-the-shelf AI IP subsystems in IoT chip development. These tools and IP blocks will reduce design complexity ...
To bridge the industry-academia gap and cultivate a future-ready talent pool, Maven Silicon, India’s leading VLSI and ...
As laptops, AI PCs, and the latest imaging systems demand even higher performance and lower power, SoCs are challenged to ...
The study, aimed at comparing the real-world behavior of each platform under intensive inference workloads, evaluates CPUs, ...
S2C, MachineWare, and Andes remain committed to advancing verification methodologies and providing scalable, efficient, and robust development tools for the RISC-V community. Together, the companies ...
The Centre for Development of Advanced Computing (C-DAC), under the Indian Ministry of Electronics and Information Technology (MeitY), has launched an indigenously built 1.0 GHz, 64-bit dual-core ...
The USB-C charging cable market is positioned for significant expansion over the coming years, driven by the increasing reliance on electronic devices and evolving connectivity demands. As technology ...
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