A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
The Chosun Ilbo on MSN
LG Innotek’s smart IC substrate halves carbon emissions, boosts durability
LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) ...
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