Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...
Morningstar

Nordson Electronics Solutions to Exhibit High-Yield Fluid Dispensing Technologies for Panel-Level and Wafer-Level Packaging at SEMICON Taiwan 2025

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, ...
Fudzilla

TSMC gets fan-out (InFO) wafer-level packaging

All ready for 2016 TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult… TSMC ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Business Wire

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

KISSIMMEE, Fla.--(BUSINESS WIRE)--SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect ...
Seeking Alpha

NVE outlines accelerated growth plans with in-house wafer-level chip scale packaging and 4% sequential revenue increase

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...
Digi Times

Samsung aims to meet Tesla's chip packaging demand with new panel-level technology

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible with conventional ...
Business Wire

Research and Markets: Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/s9zs8w/global) has announced the addition of the "Global Wafer-level ...
Electronic Design

STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
Seeking Alpha

Aehr Test Systems and ISE Labs Announce Partnership on Wafer-Level Test and Burn-in for High-Performance Computing and Artificial Intelligence Processors

FREMONT, CA / ACCESS Newswire / November 3, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced a strategic partnership with ISE Labs, ...