FREMONT, Calif. — ChipPAC Inc. here today announced it has qualified all the frontend assembly steps needed for the packaging of ICs from 300-mm diameter wafers, including new processes that will thin ...

SAN JOSE, Calif. – Corwil Technology Corp., a provider of contract assembly and wafer dicing services, today announced the acquisition of Disco Hi-Tec America's wafer thinning and polishing equipment ...

During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...

Auburn, MA – PI, a global leader in nanopositioning and motion control, is offering granite-based multi-axis precision motion systems for the automation of wafer metrology, glass substrate inspection ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...

Scientists have developed a new type of supercapacitor with the kind of flexibility and durability needed to feature in footwear and clothing, along with other devices making up the Internet of Things ...

A research team develops an assembly method for atomically thin crystals at the wafer-scale. Lego blocks, beloved by both children and adults, can be assembled into set models like space shuttles or ...

Materials science likes to take nature and the special properties of living beings that could potentially be transferred to materials as a model. A research team has succeeded in endowing materials ...

CEO of AIoT chip company XMOS, Mark Lippett is a technology leader with 25 years’ experience in startup, scale-up and blue-chip companies. Of the near-infinite oddities caused by the pandemic, the ...