When electrons flow through a resistive material, heat is generated. It’s not uncommon for high-power IC chips to dissipate greater than 50 to 100 W. A few years back, projections showed that chips ...
A new technical paper titled “DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by researchers at Intel Corporation, ...
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