The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre ...

In today's competitive industrial landscape, implementing effective reliability practices is essential. As companies worldwide pursue higher productivity, achieving best-in-class reliability practices ...

One-shot devices, which are engineered for one-time use and are often subject to destructive testing, represent an important class of critical components in areas ranging from aerospace to biomedical ...

Thin films form the basis of many industries today, including semiconductors, electric vehicles, smart optical coatings, sophisticated medical equipment, and protective layers on high-temperature ...