Numerous challenges have to be overcome during design and production of ICs below 90 nm. Manufacturing processes are still being characterized, and the interactions between the physical processes and ...

Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and ...

Diagnosis-driven yield analysis identifies the cause of systematic yield loss to speed yield ramp on new processes and improves yield on mature processes. Finding the root cause of yield loss is ...

At 65/45 nm and below, a new world order is beginning to emerge that challenges all our previous experience in IC design and manufacture. Absolute design rules and the traditional signoff process are ...

The growth of a new IC market creates ripples along the entire supply chain. Today, we see the semiconductor industry reacting to the needs of the growing automotive IC market, including the ...