The partnership enables designers to quickly evaluate machine performance with increased predictive accuracy — shortening design cycles and improving performance for applications including compressors ...
With the new ANSYS interface, users can export thermo-mechanical properties, fiber orientation and either process-induced residual stress or volumetric shrinkage data from MPI 5.1 to ANSYS software ...
How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations. Ansys RedHawk-CPA is an integrated chip–package ...
PITTSBURGH — August 24, 2022 – Ansys (NASDAQ: ANSS) said today that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the ...
Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution ...
Engineering simulation software vendor ANSYS announced May 1 that it has acquired all the assets of DfR Solutions, which specializes in applying reliability physics analysis to electronic technologies ...
System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...
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